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Täppan Cleanroom

Photo credit Thor Balkhed

Welcome to our lab

The T盲ppan Cleanroom at Campus Norrk枚ping of Link枚ping University is a cleanroom facility tailored for processing of soft functional materials. Here you may find a wide range of equipment allowing possibility to develop, pattern, and characterize advanced soft functional materials and electronic devices of the future.

The Cleanroom T盲ppan is an open facility for the entire university as well as external users affiliated with academia, research organisations and industry.

If you would like to access The T盲ppan Cleanroom as a user, you first need the 鈥淐leanroom introduction鈥�. Please, contact us to learn more.

Introduction

The T盲ppan Cleanroom at Campus Norrk枚ping consists of several different areas in ISO class 6 and 7 (FED STD class 1000 and 10 000), has specifically allocated areas for lithography, evaporation, sputtering, plasma etching, electrochemistry, scanning electron and atomic force microscopy, and electrical/optical characterization. Here you may also find a rubber lab for soft electronics and gloveboxes for performing experiments under nitrogen atmosphere.

The T盲ppan Cleanroom is part of Wise Additive, a national platform for additive manufacturing (AM). Being the central hub for additive manufacturing research and development at Link枚ping University, with a focus on printing advanced electronic materials and devices, it hosts WISE Additive Node at Link枚ping University.

About

Who can get access?

We welcome all users to access the equipment for fundamental research and development in the fields of soft electronics and functional materials. Many Täppan Cleanroom users come from academic research environment, mainly LiU. The lab is also open for the entire academic and industrial materials research community. For inquiries regarding access and accreditation, please, contact Slawomir Braun, slawomir.braun@liu.se  

What is done in the lab? 

Coating and Microfabrication 

High vacuum thermal evaporators are available for the deposition of common metals (Al, Ag, Au, Cr). Metal patterns with resolution down to ~50 碌m are achieved with plastic shadow masks made via laser patterning or using a flat-bed cutter. Standard photolithography facilities are available to achieve smaller features of ~1 碌m using etching or lift-off techniques.  


Soft patterning 

Plasma enhanced CVD is available to coat insulating layers and the three 鈥淩eactive Ion Etching鈥� setups are used to pattern polymeric materials.  


Synthesis and coatings 

Chemical synthesis and ink formulations are carried out inside state-of-the-art fume hoods and nitrogen gloveboxes. Homogenizers, ultrasonic bath sonicators, and high-power probe sonicators are available to attain homogeneous dispersions. The resulting mixtures are deposited in a variety of manners i.e. atomically thin coatings are achieved with two 鈥淟angmuir-Blodgett鈥� coaters, programmable spin coaters are used for tens-hundreds of nm coatings, blade coating for 碌m thick coatings, while electrospinning and freeze-dryers are available to attain free-standing bulks.  


Material characterization 

Surface morphology studies are carried out with optical microscopes, optical & surface profilometers, atomic forces microscopes (AFM), and a scanning electron microscope (SEM). Energy-dispersive X-ray spectroscopy (EDX) capability is available within our SEM system, providing the possibility to assess chemical composition of samples. UV-Vis-NIR, FTIR and ATR are available for absorption studies while dielectric properties are studied with a dielectric spectrometer for films and liquids. 
Climate and Humidity chambers are used for studying materials at temperatures above 0 鈦癈 and from dry to wet conditions. Low-temperature vacuum measurements are carried out inside four and six arm cryogenic probe stations with temperature ranges of 10-500K. Complete Thermoelectric (TE) characterization facilities have been developed in-house for thin films and bulk (solid and liquid) materials.  


Device characterization 

Two state-of-the-art Keithley 4200 systems with probe stations are used for diodes, transistors, and complementary circuit analysis. Electrochemical characterization of materials and devices (supercapacitors and batteries) are performed by potentiostats from Gamry and Bio-Logic. 

What kind of equipment is found here?

Here you may find a wide range of equipment allowing possibility to develop, pattern, and characterize advanced soft functional materials and electronic devices of the future. 

For full list of equi鈥媝ment, see Equipment and Resources further down on this page.

Where to find us

T盲ppan Cleanroom, T盲ppan building, Floor 3, Campus Norrk枚ping, Bedgatan 34, Norrk枚ping  

Contacts

Enquiries about lab use: slawomir.braun@liu.se

Access and new user orientation

Täppan Cleanroom is a complex environment, so good laboratory practice is essential if laboratories are to be safe places in which to work.  

Our open research facility is available to academic research groups, start-ups, and company users. All new users are required to complete mandatory training. It is a pre-requisite for all those who wish to access Täppan Cleanroom as a user. This covers such areas as safety, handling chemicals, proper cleanroom behaviour, and specific information concerning the Täppan Cleanroom.  

For more information, please contact Slawomir Braun, slawomir.braun@liu.se

Fees

See our up-to-date tool rates via the link below

Equipment and Resources

Introduction information collected from internal LIMS, equipment's official website and the responsible person of the equipment

Thin film deposition

  • • Thermal metal evaporation system, integrated with glovebox          
    Intro: Moorfield T090M. It has manual power control and three sources, which can be used separately for co-deposition. Typically, it could be used for deposition of metals such as chromium (Cr) and gold (Au).
    • Vaksis 3M Sputtering system         
    Intro: Vaksis, Midas.  This is a film coating system designed to deposit inorganic thin films on flat substrates under vacuum. It is equipped with three (3) magnetron sputtering sources, each of which can carry target plates with 2” diameter in the vacuum chamber. Currently, Ar and oxygen could be introduced. There are two magnetron and one DC sputtering sources. In addition, the substrate temperature can be controlled during the process.                                             
    • Nano-PVD-evaporator  
    Intro: Moorfield, NanoPVD-2LTE / nanoPVD-T15A. It is equipped with water-cooled magnetron sputtering sources for industry-standard 2″ targets, for thermal evaporation onto substrates up to 4″ diameter, with base pressures < 5 × 10-7 mbar. Now it is mainly used for organic materials deposition, such as PTCDI pigments.
    • 2-source thermal PVD evaporator     
    Intro: Vaksis   Handy/T2. The system is capable of evaporating metals suitable for the resistive thermal evaporation: Au, Ag, Al, Cu, Cr, etc. It is equipped with a total of two (2) thermal evaporation sources. Precision of layer thickness control is ≤ 0.1 nm.
    • Spin coaters (Laurell-FULL, LITE and for photoresist)
    • Parylene Coater   
    Intro: Diener. Parylene is the short designation of the polymer group of poly(para-xylylenes). The system allows a constant thickness of coating, independent of the substrate geometry and pinhole-free from under 1 micron. The process pressure is approx. 0.01 - 0.105mbar. 
    • Electrospinning apparatus               
    Intro: IME Technologies, EC DIG. Electrospinning is a technique for producing different fibrous structures out of a wide range of biocompatible and biodegradable materials. Next to the wide choice of materials, electrospinning allows for the inclusion of additives like nanoparticles, growth factors, proteins, or even stem cells. The system allows for precise control of parameters such as voltage (typically 10-18 kV), flow rate, needle-to-collector distance (10-20 cm), and nozzle type (e.g., coaxial for core-shell fibers).
    • Two Langmuir-Blodgett systems
    Intro: Biolin scientific, KSV NIMA. The system allows for creating thin film coatings with controlled packing density, forming model cell membranes at air-buffer interfaces, and study the effects of toxins or pharmaceuticals on the cell membrane or create functional coatings with nanoparticles.
    • Vapor phase polymerisation system    
    Intro: Grupo Selecta, Vacuo-temp. With time and temperature digital electronic control. Adjustable temperature from +5 °C TO 170 °C with the stability: ±2 °C and resolution: 1 °C. Time from 1 to 999 mins or continuous.
     

    • Lithography

  • • Heidelberg µMLA tabletop maskless aligner 
    Intro: Direct laser writer. It can expose the patterns directly without prior fabrication of a mask, resulting in a shorter prototyping cycle. It offers high alignment accuracy and a light source which generates sufficient dose to expose even thick and less sensitive resists. The system provides flexible change of pattern and software corrections. The system can produce structures down to 1 µm.      
    • Mask and Bond aligner (“sussi” MA6) 
    Intro: Sussi, MA6/BA6. The resolution is around 1-2 µm in hard contact mode on a smooth and uniform substrate. There are chucks for 4" and 6" wafers and mask-holders for 5" and 7" glass. If mask + substrate is thicker than 6 mm, proximity mode (at least) will not work.                    
    • Electron Beam Lithography (see notes at the end)          
    Intro: Raith Voyager, is a direct writing system that aims for hundreds, tens of nanometer scale of nano patterns, in the metasurface study or other optical studies. The minimum feature size of this system could reach is around 10nm for this system.
    • Akoneer Femtosecond Laser (see notes at the end)  
    Intro: Akoneer, AKO300. It is an ultrafast laser system that emits pulses on the order of femtoseconds (10鈦�¹鈦� s). High precision, at a nanoscale, laser micro machining workstation with a working area of 300x300x200 mm, equipped with 40W femtosecond laser source.
    • Nanoimprint Lithography 
    Intro: Obducat  Eitre 6. It is semi-automated for substrate sizes up to 8” x 8”, allowing pattern replication on the micro- and nanometre scale. The imprint pressure could be 6 to 80 bar, at a maximum temperature of 250鈩� (200鈩� with UV module).
     

    • Dry etching

  • • Sentech Reactive Ion Etching (RIE) 
    Intro: Sentech Instruments GmbH, Etchlab 200. The Etchlab 200 is designed for modularity, process flexibility, and simple use for all processes that are compatible with the wafer direct loading. Available gases are N2, O2, Ar, SF6 and CF4 (CF4/5%O2 mix). The substrate electrode accepts wafers from 4" to 8" in diameter. It can be tempered between 10 °C and 70 °C using an optional circulation chiller.
    • RIE/Plasma enhanced CVD        
    Intro: Advanced Vaccum (Vacutec).  This system is designed for dry etching—a process that uses chemically reactive plasma to remove material from a substrate with high precision and directionality. It is equipped with Advanced Energy RFX 600A, a 600-watt, 13.56 MHz air-cooled RF power generator. It is equipped with 4 gas lines: He, N2O, SF6 and 5% O2/CF4.
    • Zepto "Baby" RIE 
    Intro: Diener electronics, Zepto-RF-200-RIE. It is a dry-etch system for plasma-etching of substrates; available gases are O2 and Ar. It has a top-loaded aluminium chamber, two gas flow meters with valves and two settings for power and process time.
     

    • Surface Treatment

    • Ozone surface cleaning system
    Intro: Novascan, PSD-UV8. The UVO-CLEANER system with 9" x 9" stage capacity produces near-atomically clean surfaces in less than one minute by utilizing the UV/Ozone cleaning method. This process removes an assortment of organic contaminants from surfaces. These contaminants include human skin oils, silicone oils, solder flux, residues from wet cleaning processes or water residue, contamination absorbed during prolonged exposure to air, and others.
    • Oxygen Plasma Treatment              
    Intro: Diener, Zepto-W6. It is used for substrate pre-cleaning or surface activation, for example, to improve the adhesion of subsequent solutions.
     

    Surface analysis

  • • SEM       
    Intro: Zeiss Sigma 500. It is a high-resolution field-emission scanning electron microscope (FE-SEM) designed for advanced imaging and analytical applications in materials science, biology, and semiconductor research. It is capable of imaging resolution of 1-2 nm, and provides acceleration voltages from 100 V to 30,000 V.       
    • Optical profilometer 
    Intro: Sensofar PLux neox.    The Sensofar PLux neox is an optical profilometer capable of both confocal and interferometric profiling. The xyz-table is fully motorized and can only be controlled from the computer. The z-stage can move either by piezo (200 um range) or a linear motor (40 mm range). It has an automated objective turrent with room for 5 objectives. By default a 5x, 20x and 50x confocal objective and a 5x and 20x interferometric objective is installed. A 20x water submerged confocal objective is also available for installation.
    • AFM 
    Intro: Veeco, Dimension 3100.   Sample size allows up to 150 mm diameter 12 mm thick.   Video optics is with a zoom 150-675 micron viewing area.   Stage movement allows x-y 150 mm with 2 micron resolution.  
    • AFM 
    Intro: Bruker, Dimension Icon XR.  It features a large-sample, tip-scanning platform with ultra-low noise and drift (<200 pm) and a typical 90 µm scan range.  Sample size allows up to 210 mm, 15 mm thick.  Motorized position stage: 180 mm × 150 mm inspectable area.
    • Surface Profilometer
    Intro: Bruker, Dektak XT. The system is a high-precision surface profiler used for measuring thin-film thickness, step heights, roughness, and topography. Maximum step height: 1 mm. Vertical resolution: 0.1 nm. Scan length: 50 um to 50 mm. 120,000 data points per scan. Scans can be stitched end-to-end to span up to 150 mm. Wafer mapping up to 150 mm. Maximum thickness: 50 mm.
     

    • Metrology and Electrochemistry

  • • Semiconductor inspection microscope (Nikon MX350, NikonMX50, Olympus mx50)                                                         
    • Thin film analyzer (Filmetrics /Hamamatsu, F20-UV / L10290)   
    Intro: The instrument setup consists of a UV light source and film thickness instrument. Filmetrics F20 uses spectroscopic reflecting light, then analyzes this light over a range of wavelengths. The thicker the film, the more oscillations. The amplitude of the oscillations will help determine by the refractive index n and extinction k coefficients of the films and substrate. Single layer or multilayer films on substrates can be measured and analyzed. Typically, the F20 will measure thickness values between 150Å and 50um. The large spot size is about 1.5mm diameter.
    • UV-Visible Absorption spectrometer  ()  
    Intro: PerkinElmer, Lambda 900 and L1050+. They cover a wavelength range from 185 nm to 3300 nm for standard transmission measurements. The newer L1050+ system is additionally equipped for angle-dependent measurements and reflection measurements using an integrating sphere accessory.
    • Dielectric/Impedance spectrometer 
    • Contact angle goniometer Ossila
    • Microhardness tester (Future-Tech, FM-100)   
    • Free radical analyzer 
    Intro: WPI, TBR4100.  This benchtop system enables real-time detection of various analytes using electrochemical microsensors for recording fast physiological events. The system has four channels. It includes one temperature sensor and supports up to two additional sensors, with measurement capabilities for nitric oxide (<0.3 nM–100 µM), hydrogen peroxide (<10 nM–100 mM), hydrogen sulfide, glucose, and oxygen (0.1–100%). 
    • FTIR PerkinElmer Spectron 3       
    Intro: PerkinElmer, Version L1280140. The Wavelength Range of the source is 8000-30 cm-1, and the detector TGS 15000-370 cm-1 and MCT 10000-450 cm-1. The system is equipped with an Attenuated Total Reflectance (ATR) module and an integrating sphere. Liquid nitrogen is also available in the laboratory if low-temperature measurements are required.
    • Keithley power source                                 
    • Potentiostats Biologic                                                 
    • Arbitrary waveform generators (Agilent,33120A)              
    • 4-point probe (Ossila, T2001A5 Four-Point Probe Plus)    
    • 4- & 6- probe cryogenic stations
    • FET stations                                                   
    • Scanning Kelvin probe
    Intro: KP technology. SKP 5050. It utilizes a standard 2 mm gold tip to achieve a work function resolution of 1–3 meV across a 50 x 50 mm sample area, with 25 mm of automated height control for 3D surface mapping. The hardware is housed within a 450 x 450 mm Faraday enclosure and includes a color camera with a zoom lens for visualization, alongside a digital TFT oscilloscope for real-time signal monitoring.
    • Oscilloscope                                                     
    • Vertical seebeck-measurement setup          
    • Electrochemistry cell                                      
     

    • Other

  • • MetaQuip Laser engraving machine (MetaQuip, FMHUV3W)  
    Intro: This is a Laser engraving tool using a 355nm pulsed UV laser. It can be used with materials that absorb at this wavelength. It is a closed system UV laser corresponding to a class 3R machine. Depending on the lense used, the maximum area available for engraving is 70x70 mm or 110x110 mm. It uses an integrated computer and the EzCad2 software.   
    • Micromake Laser system (MikroMake system,266P_12-12-5-SM_C1)      
    Intro: Bright System, 266P_12-12-5-SM_C1.  The Bright System (Model 266P_12-12-5-SM_C1) is a high-precision laser micromachining platform that integrates a digital optical microscope with a collinear laser tool for accurate material processing. Operating as a Safety Class 1 system, it utilizes a laser source with a maximum output power exceeding 50 mW to achieve a fine spatial resolution of 4–5 μm and a patterned line width of less than 4 μm. While the stationary laser working area is 1x1 mm², the system features a 120 mm x 120 mm x 45 mm (X/Y/Z) motorized stage and utilizes a tiling technique with a stitching error of less than 2 μm to process larger patterns with high fidelity.
    • Electrohydrodynamic Jet Printing (Super Inkjet Printer, ) (WISE additive manufacturing program)
    Intro: SIJ Technology, SIJ-S050. It is a desktop-sized Super Inkjet printer by SIJ Technology designed for high-precision, sub-micron, and micron-scale patterning using electrohydrodynamic jetting. It ejects droplets ranging from 0.1 femtoliters to 10 picoliters, enabling 3D structures and,1 µm to 5 µm features. It allows to handle a range of ink viscosities from 0.5 to 10000 cPs, and allows for the deposition of, among others, conductive nano-metal inks. Besides, the pattern area is 50×50mm, and the repeatability of work stage is ±0.2μm.
    • Extrusion-based 3D printer (WISE additive manufacturing program)
    Intro: GeSiM mbH, BioScaffolder 3.3. This modular 3D bioprinting system is designed for tissue engineering and regenerative medicine research and printed electronics. The optical assembly consists of a camera system for cartridge monitoring equipped with a C-mount lens and a 365 nm UV-LED module. Connectivity is managed through a 4-port Digiport hub, with system control provided by the GeSim GUI software. Technical specifications include 4 printheads, Extrusion pressure: 100 bar, Nozzle diameter: 100 to 5000 µm, Micro-dispensing: picolitre to milliliter, with a functional operating temperature range of 4 °C to 19 °C.
    • Pipette Puller                                                 
    • Balance                                                            
    • Piezo setup     (Meysan)                     
    • Glass cutter and flatbed cutter                    
    • Glovebox and fume hoods                         
    • Cold trap cart                                                                
    • Freeze dryer     (SP SCIENTIFIC, BenchTop Pro)
    • Homogenizer
    • Liquid nitrogen                           
    • Vacuum filtration system
    • Ovens                                             
    • Ovens with vacuum                     
     

    • Notes

    • Electron Beam Lithography, Vayager 100, Raith.
    ERC Consolidated Grant, Magnus Jonsson, VisDOM, Visible Dynamic Organic Optical Metasurfaces. 2023.11-2028.10
    • Akoneer Femtosecond Laser
    ERC Consolidated Grant, Klas Tybrandt, ExpandNeuro, In Situ Expandable Ultra-Soft and Stretchable Neural Probe Clusters. 2024.02- 2029.01
     

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